Semiconductor
First wafer out on date, with every milestone evidenced.
Harmony coordinates the handoffs between construction, equipment suppliers and process engineering, and keeps the records your funders and regulators expect current.
For fab program directors, VPs of fab construction and startup, capital projects leaders and COOs in semiconductor manufacturing.
Where programs slip
- 01
Handoffs are where ramps slip
Cleanroom ready, equipment move-in, hook-up and qualification pass between the general contractor, equipment OEMs and process teams. Each group plans its piece. The gaps between them set the date.
- 02
Dated milestones need auditable proof
CHIPS milestones, tax-credit timing and export-control obligations need clean, defensible records, not a spreadsheet rebuilt every month.
- 03
Engineers on status, not yield
Scarce process and equipment engineers spend hours in coordination meetings and status rollups instead of yield learning.
How Harmony helps
A coworker on every program. Clearly software, accountable like any hire.
Owns the handoff sequence
Harmony tracks each move-in, hook-up and qualification step across contractors and OEMs, confirms readiness with the receiving team, and raises the slip before an install crew stands idle.
Keeps the milestone file current
It collects evidence for each external milestone as work completes, files it where your compliance team expects it, and drafts the report in your format.
Takes the rollup off engineering
It gathers status from email, Teams and the schedule, writes the daily and weekly updates, and pulls engineers in only when a decision needs them.
Harmony works inside your own Microsoft 365 tenant with least-privilege access and leaves a traceable record of every action for funding and export-control reviews; license determinations and program decisions stay with your people. Trust Center
Programs Harmony runs
From greenfield fab builds and N2 ramps to CoWoS capacity expansion and export-control programs, these are programs Harmony can run alongside your teams.
The common spine (IT, finance, HR, M&A, supply chain, cyber, data, regulatory) is covered in every engagement.
Sector
Fab Operations
- Greenfield fab build & tool qual
- Advanced-node capacity ramp (N2)
- Copy-exactly HVM stand-up
Sector
Process & Yield Eng.
- New-node yield-learning (N2P, A16)
- Defect-density / stochastics reduction
- GAA / nanosheet yield ramp
Sector
Design & Tape-out
- Leading-node NPI tape-out (HBM4)
- EDA flow & PDK certification
- Silicon-proven IP refresh (UCIe)
Sector
Test & Packaging
- CoWoS / HBM capacity expansion
- US OSAT integration (Amkor AZ)
- ATE rollout (Advantest, Teradyne)
Sector
Supply & Capacity
- Long-range wafer allocation
- EUV photoresist dual-sourcing
- Geopolitical supply de-risking
Sector
Trade Compliance
- BIS / EAR export controls (2026 rule)
- CHIPS Act milestone delivery
- ITAR / Trusted Foundry
What good looks like
- First wafer out on the committed date
- Every CHIPS milestone evidenced for Commerce
- Engineers on yield learning, not status reports
On the calendar
- Construction start for 35% credit (31 Dec 2026)
- BIS Affiliates Rule (9 Nov 2026)
- CHIPS award milestones
- CRA reporting (since 11 Sep 2026)
- Most CRA obligations (11 Dec 2027)
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First wafer out on the date you committed.
Contact us to learn how Harmony would take on the program in front of you.
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